ChipStack, Inc. is a leader in the rapidly emerging market for Three Dimensiional (3D) Multi-Package Modules (MPMs). Our proprietary design, manufacturing and assembly technologies combine low cost and high adaptability, allowing OEMs to stack or fold electronic circuits into MPMs while utilizing attractive component price points and availability.

The ChipStack solution does not require connectors, bumping, wire bonding or expensive material sets. Completed MPMs become a fully functional, completely tested sub-system which can be inserted into final mechanical packaging or placed directly onto a Printed Circuit Board (PCB) as a component.

Systems or sub-systems contain two, to two-hundred-plus discreet components. Placing all components and interconnect onto a singular three dimensional substrate creates an entire circuit that can be assembled and functionally tested while maintaining volume repeatability.

Without connectors, MPMs offer Industrial Design (ID) teams maximum flexibility to place electronics within enclosures requiring flex-to-fit applications.